王艳 博士，副研究员
主要从事微纳传感器件设计、纳/微跨尺度集成制造技术及3D高密度封装热设计研究。自2009年4月入职以来，先后主持、参与完成各类科研项目20余项。其中，作为项目负责人主持项目7项，主要包括：国家重大基础科研973子课题项目1项、国家自然科学基金1项、国家重点实验室基金2项、企业横向项目3项；作为第二负责人参与教育部支撑重点项目1项、02专项子课题1项、上海市科委项目2项，博士学科点专项科研基金1项，长虹合作横向项目1项，三星国际合作项目4项；此外作为阶段任务负责人参与上海市公共服务平台建设专项项目，中国商业发动机委托项目等。近三年重点参与装备预研教育部联合基金，Gf科技创新特区等项目。相关研究成果发表SCI论文20余篇。申请发明专利30余项，获专利授权12项。
联系方式：
Email: wyyw@sjtu.edu.cn
近五年主要发表论著如下：
1. Jian Li, Yan Wang*, Yue Li, Bo Fu, Yunna Sun, Jinyuan Yao, Guifu Ding, Xiaolin Zhao, Zhuoqing Yang，A contact-enhanced MEMS inertial switch with electrostatic force assistance and multi-step pulling action for prolonging contact time，Microsystem Technologies，July 2018, Volume 24, Issue 7, pp 3179–3191 （SCI）
2. Dawei Yang, Yan Wang*, Guifu Ding, Zhiyu Jin, Junhong Zhao, Guilian Wang,Numerical and experimental analysis of cooling performance of single-phase array microchannel heat sinks with different pin-fin configurations[J]. Applied Thermal Engineering,112（2017）1547-1556.（SCI）
3. Dawei Yang, Zhiyu Jin, Yan Wang*, Guifu Ding*, Guilian Wang,Heat removal capacity of laminar coolant flow in a micro channel heat sink with different pin fins,International Journal of Heat and Mass Transfer,2017,Vol 113, pp. 366-372. （SCI）
4. Liu Y, Sun Y, Wang Y*& Ding, G*. A complex reinforced polymer interposer with ordered Ni grid and SiC nano-whiskers Polyimide composite based on micromachining technology[J]. Electronic Materials Letters, 2017, Volume 13, Issue 1, pp：29-36. （SCI）
5. Li Jian, Sun Yunna, Wang Yan*, Yang Zhuoqing, Ding Guifu, Wang Hong, Zhao xiaolin,, A MEMS inertial switch with electrostatic force assistance and multi-step pull-in for eliminating bounce and prolonging contact time, (Transducers 2017), International Conference on Solid-State Sensors, Actuators and Microsystems. 2017:183-186.
6. Sun, Y., Luo, J., Yang, Z., Wang, Y*., Ding, G*., & Wang, Z. (2018). Development of a Polyimide/SiC-whisker/nano-particles composite with high thermal conductivity and low coefficient of thermal expansion as dielectric layer for interposer application. 68th ECTC 2018 (pp. 1537-1542). IEEE.
7. Sun, Y., Lee, S. L., Liu, Y., Luo, J., Wang, Y*., & Ding, G*., et al. (2017). Thermomechanical reliability of a Cu-TSV integration model based on 3D fabrication processes. EPTC 2017 (pp.704-708). IEEE.
8. Sun, Y., Lee, S. L., Xu, Q., Luo, J., Li, H., Wang, Y*& Ding, G*.., et al. (2017). A high efficient integrated heat dissipation systems with CNT array based heat lines and microchannel heat sink in 3D ICs. EPTC 2017 (pp.709-713). IEEE.
9. Sun, Y., Jin, Z., Luo, J., Li, J., Sun, Y., Wang, Y*., & Ding, G*. (2017, August). Modeling and fabrication of the redistribution layer on the 2.5 D Si interposer. ICEPT 2017 (pp. 157-161). IEEE. (Best Student Paper Award 1st Place).
10. Zhuoqing Yang, Guifu Ding, Yan Wang, Xiaolin Zhao，,A MEMS Inertial Switch Based on Non-silicon Surface Micromachining Technology， MicroElectroMechanicalSystems，2017，pp 945-995 论著
11. 李健*,王艳,杨卓青,丁桂甫，一种静电锁定垂直敏感的微机械惯性开关，CN201610546710.3，授权日：2018年9月19日
12. 姚明山*,王艳,丁桂甫,孙云娜，一种提高TSV 热机械可靠性的复合结构及其制造方法，申请日：2018年9月12日
